Tresky T-3000-HF High Force Flip Chip Bonder Hot Deal 6” x 6” x-y stage

6” x 6” x-y stage movement

Model CC58434C controller single setpoint

40% less LCO2 consumption

Adjustable clamp accepts vials in various materials to effectively grind all sample types and to avoid contamination from specific elements

Tresky T-3000-HF High Force Flip Chip Bonder Hot Deal 6” x 6” x-y stageTresky T 3000 HF High Force Flip Chip Bonder TRESKY T 3000 HF flip chip bonder is used for the epoxy dispensing and stamping, samples alignment (2 m accuracy), heating and compression to enable interconnecting devices. The bonder is capable of 20 g to 50 kg pressure, 360 die spindle rotation range, 200 mm X and Y motion range. The system is equipped with tool and substrate heat up to 400 C. Samples are aligned via HDMI camera.